Chinese Tech Firm Achieves Breakthrough in Fan-Out Panel Packaging, Set to Mass Produce in 2027

Taiwan-based semiconductor testing and packaging company, LITE-ON Technology, recently held a shareholder meeting, where its chairman, Tzou Tsok-kung, personally briefed the public on the company's latest developments and strategies in the advanced packaging sector. The most attention-grabbing highlight was LITE-ON's significant breakthrough in fan-out panel-level packaging (FOLP) technology, not only enabling a stable supply pace for Intel but also planning to enter mass production in 2027. This development demonstrates the growing importance of Taiwan's advanced packaging manufacturers in the global semiconductor supply chain.

FOLP technology has gained increasing attention in the semiconductor industry in recent years as a means to overcome traditional chip size limitations and boost computing efficiency. Compared to traditional round wafer-level packaging, FOLP employs a flat panel base instead, allowing for a larger area to accommodate more chips per production cycle, significantly enhancing production efficiency and reducing costs. Recognizing the potential of this technology, LITE-ON has continued to invest in R&D, successfully penetrating Intel's supply chain, thus proving its technical prowess to international semiconductor leaders and laying a solid foundation for the company's future growth.

In addition to deepening its collaboration with Intel, LITE-ON is also expanding its advanced packaging applications to other areas. During the meeting, Tzou Tsok-kung revealed that LITE-ON is currently working closely with telecommunications chip giant, Broadcom, to jointly develop advanced packaging substrate technologies based on FOLP. This partnership not only strengthens the two companies' partnership but also holds strategic significance, as it enables LITE-ON to enter the highly focused area of optical communication.

With the explosive growth of artificial intelligence and high-speed computing applications, data centers are increasingly demanding faster data transmission speeds and higher bandwidth, making traditional copper wire transmissions increasingly physically limited. As a result, optical communication technology has become the mainstream trend for future development. By joining forces with Broadcom, LITE-ON has successfully extended its advanced packaging capabilities to the optical communication segment, not only optimizing its product portfolio but also helping the company stay competitive in the global high-end packaging market.