Lin Visits Poland, Pushes Semiconductor Resilience and GaN Chip Development

Taiwan's Minister of Foreign Affairs, Lin Chia-lung, led a delegation to Poland on the 14th and held meetings with political figures from Poland, Lithuania, the Czech Republic, and Estonia to advance the implementation of the "Semiconductor Resilience Cooperation Project." This visit is not only a practical effort to maintain Taiwan's diplomatic visibility on the international stage, but also highlights Taiwan's urgent need to seek diversified partners amid the backdrop of global supply chain restructuring. Currently, Taiwan is recognized diplomatically by only a small number of countries, making every high-level mutual visit with European nations of significant symbolic and substantive importance.

During the discussions in Poland, Minister Lin and the Polish Minister of Foreign Affairs, the Prime Minister of Lithuania, the Czech Minister of Defense, and the Estonian Minister of Technology jointly discussed the security and resilience of the semiconductor supply chain. Taiwan holds a pivotal position in the global chip industry, particularly with its technological leadership in advanced manufacturing processes and application fields. Through cooperation with European countries, Taiwan can not only translate its technological advantages into economic benefits, but also provide the European Union with critical component supplies amid US-China technological competition, further consolidating Taiwan's core position in the global semiconductor market.

During his visit to the Łukasiewicz Research Network - Institute of Microelectronics and Photonics in Poland, Minister Lin officially announced the launch of a joint technical cooperation project with Poland on power gallium nitride (GaN) chips. With high power density, low energy consumption, and high-frequency performance, GaN chips have become core components for key applications such as 5G base stations, electric vehicle charging stations, and solar inverter systems. Taiwan possesses mature research, development, and production capacity in GaN manufacturing and packaging technologies. Combining this with Poland's expertise in materials science and optoelectronics will enable both sides to jointly break through existing technical bottlenecks and boost their competitiveness in the high-end chip market.

This collaboration is not only the first transnational implementation of Taiwan's "Semiconductor Resilience Cooperation Project," but also symbolizes Taiwan's proactive role in reshaping global supply chains. As the United States tightens export restrictions on high technology to mainland China, Taiwan can effectively diversify risks and reduce reliance on a single market by deepening cooperation with European countries, while providing the European Union with a more stable source of high-tech supplies. For Poland, cooperating with Taiwan will rapidly elevate its technological level in the advanced semiconductor field, further attracting foreign investment and talent to form a positive cycle.

Looking at the visit as a whole, Taiwan has not only maintained its diplomatic visibility on the international stage, but has also injected new momentum into its semiconductor industry through substantive technological cooperation. If such cooperation can be expanded to more European countries in the future, Taiwan will play an even more critical role in the global supply chain and bring long-term economic and technological benefits to its domestic industries. (Source: Central News Agency)