Yijia Light Communications Breaks Ground, Chip Tech Drives 30‑40% Revenue Growth in 2027

Yijia recently released its business development plan, indicating a vigorous push into the optical communications sector. Leveraging the certification of its Flip‑chip packaging technology and a ramp‑up in fourth‑quarter production, the company expects optical‑communications revenue to account for 30% to 40% of its total sales by 2027. Optical communication, which transmits data via light waves, is poised for rapid growth as 5G, cloud computing, and data‑center demands for high‑speed, low‑latency links increase. As a leading semiconductor packaging and test services provider, Yijia views optical communications as a key engine for future revenue growth and has invested heavily in product development and customer collaboration.

Technically, Yijia has achieved international certification for its Flip‑chip packaging. Known for its high density, low resistance, and low latency, Flip‑chip packaging is the preferred solution for high‑frequency, high‑power optical‑communications modules. The company began mass production of the technology in the fourth quarter and secured initial customer orders, signalling rising market acceptance. Meanwhile, its multi‑layer active packaging (mSAP) technology has entered the customer prototype stage, aiming to further improve thermal management and electrical performance of the packaging structure. With these dual technological advances, Yijia projects optical‑communications revenue to represent 30% to 40% of total sales by 2027, injecting new momentum into its future revenue mix.

Yijia is also expanding its manufacturing base in Malaysia. Malaysia offers a mature semiconductor supply chain and lower labor costs, providing a strategic advantage for Yijia’s Asian market footprint. The company has increased capacity to tens of thousands of wafers per month and plans to enhance automation and quality control to ensure rapid delivery amid soaring global demand for optical communications. Continued development of the Malaysian plant will support Asian market needs and strengthen Yijia’s competitiveness worldwide.

In terms of overseas expansion, Yijia is evaluating the feasibility of establishing a new site in North America. The North American market is one of the largest consumers of optical‑communications components, especially in the United States and Canada where data centers, 5G base stations, and high‑frequency communication equipment demand is substantial. Setting up manufacturing or service facilities in North America would dramatically shorten delivery times, reduce logistics costs, and improve responsiveness to local customers. The company has set a target of more than 50% of overseas revenue by 2028; if realized, this strategy would position Yijia more prominently within the global optical‑communications supply chain.

However, the rapid growth of the optical‑communications market brings intense competition and technological iteration. In addition to established rivals, emerging integrated‑packaging firms continually break through technical bottlenecks, threatening Yijia’s market share. Global supply‑chain uncertainty, tariff policy shifts, and raw‑material price volatility may also impact the company’s cost control and capacity scheduling. To address these challenges, Yijia must continue to strengthen R&D investment, optimize supply‑chain management, and build robust customer relationships overseas to maintain its competitive advantage in the optical‑communications arena.

Overall, Yijia’s combined focus on technology certification, capacity expansion, and overseas deployment is laying the groundwork for the sector’s rapid growth. If the company successfully commercializes Flip‑chip and mSAP, boosts capacity at its Malaysian facility, and establishes a North American presence, optical‑communications revenue is expected to deliver a significant positive impact on overall performance during 2027–2028, offering investors new growth momentum. (Source: Central News Agency)