MOEA pushes Kaohsiung Bai Pu Park to attract Q3 semiconductor packaging investment.

Taiwan has long played an indispensable role in the global semiconductor supply chain. To respond to the explosive growth of artificial intelligence and advanced computing technologies, the Ministry of Economic Affairs has recently intensified efforts to upgrade the industry and deepen local supply‑chain development. Officials stated that, in order to consolidate Taiwan’s leadership in semiconductor manufacturing and packaging, the government is fully planning and building the Kaohsiung Bai Pu Industrial Park. The park will be positioned as a flagship hub for advanced semiconductor packaging materials and equipment, with a first investor briefing scheduled for the third quarter of this year to launch the full investment campaign.

According to the ministry’s preliminary plan, the Bai Pu park will cover roughly 88.73 hectares, of which the core industrial zone will occupy about 53.63 hectares. The land allocation not only considers the future plant construction needs of incoming companies but also leaves space for flexible integration of upstream and downstream activities. The strategic goal is clear: attract international semiconductor equipment and material giants to establish research and development centers in Taiwan, while also drawing domestic and foreign innovators working on semiconductor and AI key technologies. This will further complete the technology corridor in southern Taiwan.

In recent years, the rapid adoption of generative AI and high‑performance computing has pushed traditional chip scaling techniques to their physical limits, making advanced packaging the decisive factor in semiconductor performance. Although Taiwan’s foundry and test‑and‑packaging sectors remain global leaders, the associated chemical materials and precision equipment have historically depended heavily on imports from Europe, America, Japan, and other countries. By developing the Bai Pu park, the ministry aims to leverage geographic advantages and policy incentives to bring key material and equipment suppliers on‑site, shorten supply‑chain distances, reduce logistics and time costs, and thereby enhance Taiwan’s overall semiconductor industry autonomy and risk resilience.

From a macro perspective of regional economics and industrial clustering, the Bai Pu park will create strong magnetic and spill‑over effects with the existing Southern Science Park, Nan‑zi Technology Industrial Park, and Qiaotou Science Park. When these parks are interconnected, they will span the entire semiconductor ecosystem—from upstream IC design and wafer manufacturing to downstream advanced packaging, material supply, and equipment production—forming a tighter and more complete ecosystem. This integration will attract top global talent to the south, drive the transformation and upgrade of Kaohsiung’s traditional industries, and generate a large number of high‑wage job opportunities.

Looking ahead, the official investor briefing in the third quarter will mark the beginning of actual development and investment activities for the Bai Pu park. How the Ministry of Economic Affairs and local governments effectively resolve issues such as water and power supply, transportation infrastructure, and environmental assessment will be crucial to ensuring that international giants can settle smoothly. If the park successfully attracts flagship companies, it will not only create another golden decade for Taiwan’s semiconductor industry but also cement Taiwan’s irreplaceable strategic position amid the global AI supply‑chain restructuring.