AI computing boom drives global terminal demand, transforming Taiwan's PCB industry.

The wave of artificial intelligence technology continues to expand across the global market, resulting in an exponential surge in the demand for terminal computing power. This robust demand for computing power has not remained confined to the level of semiconductor chip design; rather, it has completely spilled over downward, simultaneously driving the printed circuit board (PCB) industry—the cornerstone of electronic components—toward a comprehensive revolution spanning material science, manufacturing processes, and system packaging architectures. Faced with this rare and large-scale wave of industrial upgrading, Taiwan's PCB industry chain stands at a crossroads of technological transformation, poised to embrace unprecedented opportunities and severe challenges.

Amidst this industrial upheaval, the annual Taiwan PCB industry grand event is scheduled to officially kick off on October 20. Serving as a crucial bellwether for the global PCB industry, this exhibition is expected to gather major supply chain manufacturers, technical experts, and buyers from around the world. Driven powerfully by artificial intelligence and high-performance computing applications, the core focus of this exhibition will unquestionably lock onto key issues such as advanced packaging technology, glass substrate applications, high-end material development, supply and demand dynamics for substrates, and the proactive capacity expansion layouts undertaken by Taiwanese domestic manufacturers both at home and abroad.

Delving into the technical dimension, as the sizes of AI chips continue to scale up, traditional packaging and PCB substrates are gradually facing challenges from physical limitations. To achieve higher transmission rates, lower signal loss, and superior thermal dissipation performance, the introduction of advanced packaging and next-generation substrate materials has become an urgent imperative. Among them, glass substrates are regarded by the industry as a killer technology capable of breaking through the limits of traditional plastic substrates due to their exceptional flatness, superior thermal stability, and finer circuit resolution capabilities. They are expected to become a focal point of technological discussion among all sectors at this exhibition.

In addition to the revolutionary transformation of substrate materials, the supply and demand balance of high-end materials and substrates is another major indicator that touches the nerves of the global electronics industry. As servers and data centers impose increasingly stringent requirements on high-frequency and high-speed transmission, upstream materials such as relevant resins and copper-clad laminates must be upgraded simultaneously. This not only tests the research and development capabilities of material suppliers but also directly impacts the capacity allocation and market supply conditions of high-end substrates. How the upper and lower tiers of the industry chain respond to this demand peak and adjust their production lines and technological alignment will be a focal point of observation for all parties during the exhibition.

Faced with changes in the global political and economic landscape as well as customers' high demands for supply chain resilience, Taiwanese PCB manufacturers have noticeably accelerated their pace of globalization in recent years. From the automation upgrades and high-end capacity expansions of domestic plants to the strategic establishment of overseas production bases, Taiwanese manufacturers are actively constructing a more flexible global supply network. This exhibition serves not only as a platform for technology display, but also as a vital window for the outside world to examine how Taiwan's PCB industry consolidates its leading position through capital expenditures and strategic alliances amidst global technological competition.